With the development of electronic technology,Shenzhen Microwave BoardThe application is suitable and extensive, and the structural planning is getting higher and higher. New applications emerge in endlessly, and a wide variety of products have been widely used in communication equipment, consumer electronics, industrial control, automotive electronics, medical security, aerospace and other high-tech products. When it comes to high-frequency microwave/RF substrates (RF board processing), there are hard substrates or soft substrates. A rigid substrate, also known as a substrate, is some kind of ceramic or insulator used to develop semiconductors, devices, components, or films, but can also be used to make larger devices, such as amplifier trays. Soft substrates, or microwave substrates for short, are the materials commonly used in the development of RF/microwave printed circuit boards.

The dielectric constant or relative permittivity of a high-frequency microwave RF board (RF board processing) is a measure of the dielectric properties relative to air at room temperature. The dielectric constant of a high-frequency microwave radio-frequency plate determines the behavior of the electric field through the material and is a function of frequency. For high frequency applications, a low dielectric is desirable because it minimizes the parasitic capacitance between the trace and the conductive structure. This factor also determines the geometry of planar structures such as microstrip lines, stripline transmission lines and antennas.

The requirements for high-frequency microwave characteristics of printed circuit boards are put forward, and the requirements for materials are bound to be higher and higher. For Shenzhen microwave board printed circuit board, the substrate used is completely different from the FR-4 glass fiber board on the glass fiber cloth and filler. Such high frequency microwave materials are now used for high density interconnect boards. Production is still in the rooting stage. Due to different materials, in the production processShenzhen Microwave BoardExplosions and other unusual problems. This paper takes multilayer HDI ceramic board as an example to introduce the key technology in the production process. High-frequency microwaves, as the name suggests, have high frequencies and short wavelengths. How short they are will be described quantitatively below. Generally, electromagnetic waves with a wavelength of 1m to 0.1mm and a corresponding frequency range of 300MHz to 3000GHz are called microwaves. It can be seen from the electromagnetic spectrum that the low-frequency end of the microwave is close to the ultrashort wave, and the high-frequency end is close to the infrared light, so it is a wide frequency band with a width of 3000GHz, which is tens of thousands of times wider than the sum of all ordinary radio bands.

At present, the Shenzhen microwave board (high-frequency microwave radio frequency board) material is not mature enough for multi-layer bonding of high-density interconnection boards. The production references are summarized as follows:

(1) The material pressing conditions of Shenzhen microwave board (high frequency microwave radio frequency board) are higher than ordinary FR-4. Adjusting the pressing procedure and typesetting method to solve the problem of pressing holes caused by material performance problems;

(2) High frequency ceramic plate prepreg is composed of ceramic and colloid. The prepreg content of the prepreg is extremely low, almost zero, the bonding force of the copper foil is poor, and the adhesion of the copper foil is weak. By adjusting the pressing structure, it can be improved. class problems;

(3) Shenzhen microwave board (high-frequency microwave radio frequency board) is a ceramic material with brittle and hard physical properties. The traditional chemical degumming method (KMnO4 H2SO4) has low bite and corrosion efficiency. The amount of degumming is large, and the drilling parameters are adjusted at the same time to improve the drilling thickness and degumming;

(4) ThisShenzhen Microwave Board(High-frequency microwave radio frequency board) is made by pressing prepreg and copper foil, and bubbles appear. It is made by pressing the code. Blind holes are stacked holes, and the laser can optimize the process. In this process, the production cost of browning, electroplating, outer layer and other processes is reduced. At the same time, under the existing conditions, labor costs and material costs continue to rise, which improves the efficiency of the company.